Mil Standard Thermal Shock Chamber

CME’s standard and customized products allow the simulation of the most diverse environmental condition. Among wide range of customized solutions, MIL standard Thermal shock chamber is one which is customized to test various products for continuous environmental changes from extremely high to low temperature within a short time frame.

Thermal shock testing subjects products to sudden temperature changes. These changes can be either air-to-air changes. The definition of “sudden” temperature change varies depending on the standard followed, but generally should be within minutes.

Temperature shock testing can help determine physical, chemical and operation problems of a product. Some examples of physical problems are shattering, binding or cracking of either the surface or internal components. Sudden temperature changes can occur, among other things, during transport from an air-conditioned room indoors to a high temperature desert outdoors.

Products used in the military, for example, are tested to temperature shock. This may happen the moment during a delivery to target where the transfer may take place in land, sea or air. The storage temperature may be cold and the deployment temperature hot, or vice versa.

Thermal Shock Test Procedure for Electrical Connectors and Sockets. Two methods are listed to simulate the worst probable conditions of storage, transportation, and application. Method A is for air-to-air thermal shock and Method B is for air-to-liquid nitrogen thermal shock. Another example is MIL-STD-750 which is the Department of Defence’s test method standard for semiconductor devices. Liquid-to-liquid thermal shock testing is required, where the transfer time from hot to cold or cold to hot shall not exceed 10 seconds.